Process Capability


项目Items 元器件类型 Component Types 直通率 Pass Rate 器件贴装  SMT 器件焊接 Component Soldering
阻容件&二极管&三极管Resistors, Capacitors & Diodes & Transistors 最小元器件 Minimum Components 99.98% 器件大小: 01005~55mm Component Size: 01005~55mm 焊接精度土 0.08mm Soldering Precision: ±0.08mm
连接器Connectors 最小焊盘间距/0.3mm  Minimum Pad Spacing/0.3mm 99.95% CONN中心间距:最小0.3mm CONN Center Spacing: Minimum 0.3mm 焊接角度: 1° Soldering Angle: 1°
芯片BGA Chip BGA 最小间距/0.25mm  Minimum Spacing/0.25mm 99.90% CONN长度: 最大150mm  CONN Length: Maximum 150mm 共线度: 0.08mm Coplanarity: 0.08mm
芯片QFN&QFP等 Chip QFN & QFP, etc. 最小间距/0.3mm  Minimum Spacing/0.3mm 99.90% BGA最小球径:015mm BGA Minimum Ball Diameter: 0.15mm  
发光二极管LED Light Emitting Diodes (LEDs) 角度/±1°  Angle/±1° 99.95% BGA最小脚距0.25mm  BGA Minimum Pitch: 0.25mm  
      器件到板边:Min 0.3mm  Component to Board Edge: Min 0.3mm  
      器件到屏蔽盖: Min0.5mm  Component to Shield Cover: Min 0.5mm  
      贴装精度: 30um (Cpkz1) Placement Accuracy: 30μm (Cpkz1)