New 8-layer 2-stage Bluetooth headset circuit board


 

Number of product layers

8Level 2

Product size

26.52mm *5.21mm

Surface treatment

ENIG(Shen Jin)

Finished plate thickness

0.75±0.08mm

Assembly method

SMT

Application areas

Bluetooth headset

Product characteristics

8Layer 2 stacked hole Bluetooth module products

Resin Plug Holes Laser Stacked Holes Design

White ink minimum solder resist bridge 75μm