LBGA-IC Substrate


① The center position is equipped with a large gold surface mounted chip, and the bottom heat dissipation is conducted through a through-hole.  
② A row of 33 gold fingers for threading, totaling 132 gold fingers.  
③ A row of 12 solder ball pads, totaling 144 pads.  
④ Golden finger width CPK 4.08, pad width CPK 3.31.
⑤ Gold wire binding tensile test, determine ACC.  
⑥ The minimum tensile force is 4.212g.