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About
Sichuan Yingchuangli Electronic Technology Co., Ltd. was established in 2011 and is an integrated manufacturer specializing in providing one-stop services for electronic circuit design, printed circuit board processing, and e
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product technology
Sichuan Yingchuangli Electronic Technology Co., Ltd. was established in 2011 and is an integrated manufacturer specializing in providing one-stop services for electronic circuit design, printed circuit board processing, and e
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Join us
Founded in 2011,lnno Circuits Limited specializes in providing one-stop services for electronic circuit design, printed circuit board processing,and electronic assembly.
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News
Sichuan Yingchuangli Electronic Technology Co., Ltd. was established in 2011 and is an integrated manufacturer specializing in providing one-stop services for electronic circuit design, printed circuit board processing, and e
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Contact
Sichuan Yingchuangli Electronic Technology Co., Ltd. was established in 2011 and is an integrated manufacturer specializing in providing one-stop services for electronic circuit design, printed circuit board processing, and e
Process capability
|
Category |
Term |
Processing capacity |
|
General Rigid |
Layer account |
2-48L |
|
Overall Thk. |
0.1-6.35mm |
|
|
Min. W/S |
64μm/64μm |
|
|
Max. processing size（mm） |
800×620mm |
|
|
Min. drilling hole size |
0.15mm |
|
|
Copper thk |
6 OZ(Inner),10 OZ(Outer) |
|
|
Min Solder mask dam |
50μm |
|
|
Aspect ratio |
20:1 |
|
|
Impedance tolerance |
±8% |
|
Category |
Term |
Processing capacity |
|
HDI |
Lamination structure |
6+N+6 |
|
Min. laser hole/ring |
70μm/25μm |
|
|
Copper concavity |
≤5μm |
|
|
Max. lamination |
7 times |
|
|
Blind hole aspect ratio |
0.9:1 |
|
Category |
Term |
Processing capacity |
|
IC Carrier & Mini-LED |
Min W/S |
25μm/25μm |
|
Min mechanical hole/pad |
100μm/150μm |
|
|
Min pad size |
50μm |
|
|
Min pad space |
40μm |
|
|
Min Solder mask dam |
50μm |
|
|
Offset of solder mask opening |
≤20μm |
|
|
Interlayer alignment |
≤10μm |
|
|
Overall Thk. |
0.1mm-5.0mm |
|
|
Max panel size |
530mm*620mm |
|
|
Distance_Finger center |
0.09mm |
|
|
Solder mask flatness |
Max. 5μm |
|
|
Min. W/S |
35μm/35μm（Mini-LED） |
|
|
Overall thk. flatness |
±5%（Mini-LED） |
|
|
Min. lighter pitch space |
P0.6mm（Mini-LED） |
|
|
General material |
FR-4: SYTECH,ITEQ,Nouya,Huazheng etc. High Frequency: Rogers,Arlon,AGC, WL,Ruilong、FsD etc High Speed: Pansonic,TaiyO,ITEQ,EM,SYTECH, etc. Flex : Doosan,ITEQ,Pansonic,Dupont,SYTECH,Xinyang,Taiflex, etc. IC Carrier :Doosan、SYTECH、MGC, etc. |
|
|
Finishing |
OSP,HASL/HASL LF,ENIG/ENEPIG, Plated gold(Hard gold or soft gold),Immersion Ag,Immersion Tin, ENIG+hard gold,ENIG+OSP |
|
|
Special Technology |
Step slot, Depth routing,Back drill,Burried R&C,bedded copper,Blind&buried vias, plated half holes,Resin plugging,Edge plating |
|
Suining Headquarters
Address: No.1, Zhangshulin Road, Economic and Technological Development Zone, Suining City, Sichuan Province
Telephone: +86 188-0080-0786
Mailbox: check12@iqpcb.com
Overseas Marketing Department
Address: 2516/11,Meinian Center,1388 Tianfu Avenue,Wuhou Dist., Chengdu, Sichuan,China,610041
ProvinceTelephone: +86 13696003669
Mailbox: marketing@iqpcb.com
India Service Center Address：609, 6th floor DLF galleria complex,DLF phase 4 Gurgaon haryana 122009
ProvinceTelephone: +91 9875777998
Mailbox: Deepak@iqpcb.com