SSD board
| Layer Number |
6Layer1Stage |
| Product size |
22* |
| Surface treatment |
gold+plating hard gold |
| Finished plate thickness |
0.85±
|
| Assembly method |
SMT |
| Application areas |
Solid-state storage such as computer servers and workstations |
| Product characteristics |
|
| ① high frequency and high speedSSDStorage Panel; ② Inner and outer layer copper thickness average35μm; ③ Laser blind hole design, interlayer offset ≤30μm, arbitrary layer bias ≤50μm; ④ Impedance control100±10Ω; ⑤ The surface treatment adopts the selective process, the pad selects the gold, and the gold finger is plated with hard gold. |
|