SSD board


 

 

Layer    Number

6Layer1Stage

Product size

22*80mm

Surface treatment

gold+plating hard gold

Finished plate thickness

0.85± 0.08mm

Assembly method

SMT

Application areas

Solid-state storage such as computer servers and workstations

Product characteristics

 

high frequency and high speedSSDStorage Panel;

Inner and outer layer copper thickness average35μm;

Laser blind hole design, interlayer offset ≤30μm, arbitrary layer bias ≤50μm;

Impedance control100±10Ω;

The surface treatment adopts the selective process, the pad selects the gold, and the gold finger is plated with hard gold.