Bluetooth headset circuit board


 

Layer    Number

8Layer2Stage

Product size

26.52mm*5.21mm

Surface treatment

ENIG(Shen Jin)

Finished plate thickness

0.75± 0.08mm

Assembly method

SMT

Application areas

Bluetooth headset

Product characteristics

 

8Layer2Stacked hole Bluetooth module products

② Resin plug hole+Laser stacked hole design

③ White ink minimum solder bridge75μm