Carrier plate


① The chip is pasted on the big gold surface in the center, and the heat dissipation at the bottom is conducted through the through hole.
② A row of 33 wired gold fingers, totaling 132 gold fingers.
③ A row of 12 solder ball pads, a total of 144 pads.
④ Gold finger width CPK 4.08, pad width CPK 3.31.
⑤ Gold wire binding tensile test to determine ACC.
⑥ Minimum pulling force 4.212g.