SSD board


 

Layer     Number

6Layer1Stage

Product size

22*80mm

Surface treatment

gold+plating hard gold

Finished plate thickness

0.85±0.08mm

Assembly method

SMT

Application areas

Solid-state storage such as computer servers and workstations

 Product characteristics

① high frequency and high speedSSDStorage board.

② Inner and outer layer copper thickness average35μm.

③ Laser blind hole design, interlayer offset≤ 30μm, arbitrary layer bias≤ 50μm.

④ Impedance control100 ± 10Ω.

⑤ The surface treatment adopts the selective process, the pad selects the gold, and the gold finger is plated with hard gold.