SSD board
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Layer Number |
6Layer1Stage |
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Product size |
22* |
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Surface treatment |
gold+plating hard gold |
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Finished plate thickness |
0.85± |
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Assembly method |
SMT |
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Application areas |
Solid-state storage such as computer servers and workstations |
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Product characteristics |
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① high frequency and high speedSSDStorage board. ② Inner and outer layer copper thickness average35μm. ③ Laser blind hole design, interlayer offset≤ 30μm, arbitrary layer bias≤ 50μm. ④ Impedance control100 ± 10Ω. ⑤ The surface treatment adopts the selective process, the pad selects the gold, and the gold finger is plated with hard gold. |
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