Yingchuang Power

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Board Division

The first IC carrier board shipped!!

The IC carrier board (IC Package Substrate) is the carrier that connects and transmits the signal between the bare chip (DIE) and the printed circuit board (PCB). It is the key in the packaging and testing process. It is developed on the basis of the relevant technology of the PCB board. It is used to establish the signal connection between the IC and the PCB and plays a role of "connecting the preceding and the following.

With the development of terminal electronic products in the direction of multi-function, intelligence and miniaturization, the demand for high integrated circuits has accelerated the rapid growth of the package carrier market, in the package carrier market, the WB-BGA package type carrier board occupies a huge market share, packaging products are widely used in mobile phones, smart home, smart wear and other fields.

Product Introduction

Stack Design

Binding Gold Finger PAD

● The chip is pasted on the large gold surface in the center, and the bottom is turned on to dissipate heat through the through hole.

● A row of 33 wired gold fingers, totaling 132 gold fingers.

● Gold finger width CPK 4.08.

BGA pad width

● The chip is pasted on the large gold surface in the center, and the bottom is turned on to dissipate heat through the through hole.

● A row of 12 solder ball pads, a total of 144 pads.

● Pad width CPK 3.31.

Tensile test

● Gold wire binding tensile test to determine ACC.

● The minimum pulling force is greater than or equal to 3g, of which the minimum pulling force is 4.212g.

● Optical cross punctuation, easy to interpret at right angles to the center.