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Sichuan Yingchuangli Electronic Technology Co., Ltd. was established in 2011 and is an integrated manufacturer specializing in providing one-stop services for electronic circuit design, printed circuit board processing, and e
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Sichuan Yingchuangli Electronic Technology Co., Ltd. was established in 2011 and is an integrated manufacturer specializing in providing one-stop services for electronic circuit design, printed circuit board processing, and e
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Founded in 2011,lnno Circuits Limited specializes in providing one-stop services for electronic circuit design, printed circuit board processing,and electronic assembly.
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Sichuan Yingchuangli Electronic Technology Co., Ltd. was established in 2011 and is an integrated manufacturer specializing in providing one-stop services for electronic circuit design, printed circuit board processing, and e
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Sichuan Yingchuangli Electronic Technology Co., Ltd. was established in 2011 and is an integrated manufacturer specializing in providing one-stop services for electronic circuit design, printed circuit board processing, and e
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Professional to provide electronic circuit design, printed circuit board processing, electronic assembly one-stop service
InnoLight Releases 1.6T Optical Module Board, Offering a New Solution for AI Data Transmission
Release time：
2026-01-26
As the bandwidth of a single cabinet in intelligent computing centers leaps from 800G to 1.6T, AI large-model training places extraordinarily high demands on data transmission. The insufficient bandwidth, signal distortion, and cooling challenges inherent in traditional optical module boards have become key bottlenecks hindering the full realization of computing power.
With years of deep expertise in the high-speed communication PCB field, Yingchuangli has precisely identified industry needs and recently launched a 1.6T AI server optical communication module board. This product achieves comprehensive breakthroughs across three key dimensions—rate, process, and materials—effectively addressing the challenges of high-speed data transmission.
To meet the exponentially growing demand for computing power, the company has achieved a critical technological leap.
The rate-end keeps pace with industry trends, gradually iterating from 800G to 1.6T, ensuring that transmission speeds stay ahead of computing power demands.
The process has been upgraded to an improved semi-additive method, overcoming the challenges of high-density wiring and precise impedance control.
At the material end, we’ve selected a high-speed, low-loss substrate to minimize signal transmission loss and pave the way for a “high-speed channel” for data.
Zero signal loss: Utilizing TaiGuang EM890K series boards and HVLP2 copper foil, with a dielectric constant ≤ 2.98 and a dielectric loss ≤ 0.0018, ensuring complete and undamped transmission of massive data volumes.
Excellent in both wiring and heat dissipation: 10-layer, 2nd-level blind-buried via design enables denser wiring while optimizing chip thermal dissipation efficiency, ensuring long-term stable operation of high-density devices.
One board, dual compatibility: Nickel-palladium-gold thick-palladium plating process (Pd: 0.3–0.6 μm) balances durability for plug-and-play applications with the need for wire bonding to chips, thereby reducing scenario adaptation costs.
Stable and reliable connection: The bonding fingers are designed with dimensions of 80 μm × 150 μm, achieving ultra-high alignment accuracy of ±10 μm for the lines, and meeting the redundancy and positioning requirements for gold wire bonding finger sizes.
Zero-distortion transmission: Meets the high-precision control requirement of impedance tolerance within ±5%, with impedance line width accuracy controlled to within ±5 μm and actual dielectric thickness matching the simulated value within a deviation of ±3 μm, comprehensively ensuring stable impedance performance.
Left: Composite Composition Right: Slice Diagram
The product’s application scenarios cover four core areas: intelligent computing center server clusters, AI large-model training/inference clusters, supercomputing centers, and high-density cloud computing data centers. It can support ultra-high-bandwidth intercommunication within a single cabinet, enabling “millisecond-level response” for data transmission; at the same time, it accelerates the R&D iteration of large models and the scientific computing process, providing critical transmission support for digital transformation across various industries.
The newly launched 1.6T optical module board marks that the company’s related technologies have reached an internationally leading level. In the future, Yingchuangli will continue to focus on technological innovation as its core, introducing more high-performance products to help accelerate and stabilize global computing power transmission.
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