new strength.

Yingchuang is the first domestic enterprise in Southwest China to enter the field of advanced packaging substrates. The existing supporting modern IC carrier board production base, the world's leading automated production equipment, industry-leading production technology, experienced professional management team, annual production capacity of 100000 square meters.

Development vitality continues to burst

Innovation momentum to rush

The company once again introduced the storage class package carrier board.

Product display

Physical display

Stack Design

memory chip

A memory chip is a semiconductor chip for storing data and information. It can retain the stored data after power failure, with memory function. Performance indicators of a memory chip generally include storage capacity, read/write speed, data retention time, power consumption, and the like.

For example, in our mobile phones, memory chips are used to store data such as photos, videos, applications and system files. The hard disk or solid-state hard disk in a computer is also a memory chip, which is used to store various information such as operating systems, documents, games, etc.

Storage class package carrier board

The storage package carrier board is a substrate that plays a key support and connection role in the process of packaging the memory chip, realizes the electrical connection between the memory chip and the external circuit, provides physical support for the memory chip, and ensures the stability and reliability of the chip after packaging.

Advantages of this case

High precision wiring

Products using advanced laser X-hole copper plug technology, the smallest hole diameter 0.1mm The minimum line width is 30 μm/30 μm, which meets the requirements of memory chips for high-speed and high-bandwidth data transmission.

Good heat dissipation performance

Product size 13.7mm × 7.6mm Finished plate thickness 0.25 ± 0.05mm , Reduce the volume and weight of the entire memory module, and provide good heat dissipation performance for the memory chip.

Stable electrical performance

The WB-BOC packaging technology with low production cost and high yield is adopted to provide stable electrical connection for the memory chip and ensure the stability and reliability of signal transmission.

High-quality production materials

The use of high-performance, high quality SI10U domestic BT material to ensure the durability and functionality of the product.

Excellent protection performance

ENIPIG (nickel palladium gold) surface treatment provides good mechanical strength, corrosion resistance and weldability for the product, ensuring the accuracy and reliability of stored data.