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Sichuan Yingchuangli Electronic Technology Co., Ltd. was established in 2011 and is an integrated manufacturer specializing in providing one-stop services for electronic circuit design, printed circuit board processing, and e
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Sichuan Yingchuangli Electronic Technology Co., Ltd. was established in 2011 and is an integrated manufacturer specializing in providing one-stop services for electronic circuit design, printed circuit board processing, and e
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Founded in 2011,lnno Circuits Limited specializes in providing one-stop services for electronic circuit design, printed circuit board processing,and electronic assembly.
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Sichuan Yingchuangli Electronic Technology Co., Ltd. was established in 2011 and is an integrated manufacturer specializing in providing one-stop services for electronic circuit design, printed circuit board processing, and e
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Sichuan Yingchuangli Electronic Technology Co., Ltd. was established in 2011 and is an integrated manufacturer specializing in providing one-stop services for electronic circuit design, printed circuit board processing, and e
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Professional to provide electronic circuit design, printed circuit board processing, electronic assembly one-stop service
Yingchuang released SIP carrier board to help the rapid development of advanced packaging field
Release time：
2024-06-28
Yingchuangli deeply ploughed the electronic circuit industry, with strong technological innovation capabilities and R & D and manufacturing strength, among the domestic advanced packaging substrate field, and constantly promote the domestic semiconductor industry chain to achieve a new breakthrough. Recently, the company's product research and development has made a new breakthrough, the heavy launch of advanced packaging SIP Bluetooth module carrier board!
Product display
Product size
Product Introduction
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Number of layers |
Level 4 Level 1 |
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Product size |
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Surface treatment |
Nickel Palladium |
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Finished plate thickness |
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Substrate |
R04350B |
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Solder mask color |
Green |
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Minimum line width/line spacing |
3.9mil/10mil |
laminated structure
What is SIP encapsulation
What role does the carrier board play in advanced packaging
Advanced Packaging SIP Bluetooth Module This Case Advantage
miniaturizationIntegrating multiple components into a single package can save 65% of space, which is particularly beneficial for portable and wearable devices.
Lightweight and thinReduce the discrete components required for the design, the overall thickness is reduced by 33%-50%, and the manufacturing cost is reduced.
Excellent heat dissipationThe temperature in the component drops by 9 ℃, achieving high performance and high reliability, especially in high-power and high-density application scenarios.
High signal-to-noise ratioThe design layout is complex, the interconnection components are flexible, low noise transmission, and the signal interference and crosstalk are effectively reduced by 40%.
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